Contents
Tuesday, Nov. 12, a.m. / Life Hall
| 09:20-09:30 | (1)Opening remarks | K. Nakamae | Chairman, The Institute of NANO Testing |
Invited Talk I
Chairman：Koji Nakamae
| 09:30-10:30 | (I1)Development of an integrated measurement system for management of nanomaterials, and standardization of output data formats of measurement and analysis instruments | S. Ichimura | Waseda University |
《10:30～10:50 Authors corner & break》
Metrology and Inspection I
Chairman：Yoichi Ose
| 10:50-11:15 | (2)The Roughness Control in The Silicon Thinning Process for Failure Analysis Samples | Y. I. Kawamura(a, A. Uvarov(b, A. Pageau(b, H. Shibata(a, T. Lazerand(b | a)Plasma-Therm-Japan K.K., b)Plasma-Therm Europe |
| 11:15-11:40 | (3)Evaluation of hole shape using roundness and circularity for process evaluation | H. Nakao, W. J. Know, C. Kang, H. Tanaka | Thermo Fisher Scientific |
《11:40～12:00 Authors corner & break》
《12:00～13:15 Lunch Break》
Tuesday, Nov. 12, p.m. / Life Hall
Invited Talk II
Chairman：Yasuhisa Higuchi
| 13:15-14:15 | (I2)Overview of generative AI implementation in industrial manufacturing Talkative Products’ business and technical challenges | M. Naemura | Hitachi Industrial Equipment Systems Co., Ltd. |
《14:15～14:35 Authors corner & break》
Metrology and Inspection II
Chairman：Suigen Kyoh
| 14:35-15:00 | (4)Automated cross-sectional SEM observation technology using image recognition of semiconductor-device structures | T. Dobashi, H. Yamamoto, T. Ohmori | Hitachi Ltd. |
| 15:00-15:25 | (5)A generative model for SEM images of semiconductor line patterns and its application in metrology | S. Asano, Y. Midoh, J. Shiomi, N. Miura | Osaka University |
《15:25～15:45 Authors corner & break》
Metrology and Inspection III
Chairman：Shunsuke Asahina
| 15:45-16:10 | (6)A study of robust pattern contour extraction using contour vibration network | S. Murakami(a, M. Oya(a, Y. Okamoto(b, S. Nakazawa(b, K. Maruyama(b, Y. Yamazaki(b, Y. Midoh(a, N. Miura(a | a)Osaka University, b)TASMIT, Inc. |
| 16:10-16:35 | (7)Development of advanced pattern contour extraction function for underneath pattern in BSE see-through image of high voltage SEM | M. Oya(a, Y. Okamoto(b, S. Nakazawa(b, K. Maruyama(b, Y. Yamazaki(b, S. Murakami(a, Y. Midoh(a, N. Miura(a | a)Osaka University, b)TASMIT, Inc. |
《16:35～16:55 Authors corner & break》
Wednesday, Nov. 13, a.m. / Life Hall
Metrology and Inspection IV
Chairman：Yuichiro Yamazaki
| 09:30-09:55 | (8)Time-resolved measurement using pulsed scanning electron microscope equipped with NEA secmiconductor photocathode as electron source | H. Morishita(a, T. Ohshima(b, M. Kuwahara(c, T. Agemura(b, Y. Ose(b, D. Takane(a, T. Saito(b | a)Hitachi, Ltd., b)Hitachi High-Tech Corporation, c)Institute of Materials and Systems for Sustainability, Nagoya University |
| 09:55-10:20 | (9)Relationship between contrast formation in the mirror electron images and the distribution of crystal defects in polishing damage introduced on the surface of SiC wafers. | H. Sako(a, S. Hayashi(a, K. Ohira(b, K. Kobayashi(b, T. Isshiki(c | a)Toray Research Center, Inc., b)Hitachi High-Tech Corp., c)Kyoto Institute of Technology |
《10:20～10:40 Authors corner & break》
Commercial Session
Chairman：Hitoshi Maeda
| 10:40-10:47 | (C1) High-speed sample processing system by pulse laser | K. Suzuki, S. Ichikawa, O. Tasgit | NanoTech Solutions Inc. |
| 10:47-10:54 | (C2)Effectiveness of CAD-navigation Tools in Failure Analysis using EOP | T. Imoto, K. Hirai | TOOL Corporation |
| 10:54-11:01 | (C3)Introduction of Sequencer software U15707-03 for Emission microscope | M. Fujiwara, K. Kudo, S. Suzuki, T. Yamada, Y. Kano | Hamamatsu Photonics K.K. |
| 11:01-11:08 | (C4)Emission microscopes and peripheral equipment | K. Koshikawa, Y. Numajiri, Y. Nakashima | TOKI COMMERCIAL CO., LTD. |
| 11:08-11:15 | (C5)Imina Technologies Nano probing system | Y. Nakayama(a, R. Claassen(b, S. Ogawa(a | a)APOLLOWAVE Corporation, b)Imina Technlogies SA |
| 11:15-11:22 | (C6)Unveiling the Advantages of the Thermo Fisher Hyperion II AFM-based Nanoprobing System in Transistor Characteriza-tion and Fault Localization | Y. Koya, J. Sanders | Thermo Fisher Scientific |
| 11:22-11:29 | (C7)Introduction of EBAC Image Analysis Software Image Data Manager | J. Fuse, T. Shimamori, Y. Wu, M. Ozawa, M. Watahiki, N. Bito, M. Hijikata | Hitachi High-Tech Corporation |
| 11:29-11:36 | (C8)Analysis system AZSA series | K. Konishi | Astron,Inc |
| 11:36-11:43 | (C9)Visualization of p-n junctions of SiC devices using “Spectrum Image” using the Auger Electron Spectrometer (JAMP-9510F) | K. Ikita, F. Nabeshima, K. Tsusumi | JEOL Ltd. |
| 11:43-11:50 | (C10)Introduction of new DualBeam system, Helios 6 HD | T. Muneta, K. Mu | FEI Company Japan Ltd, |
| 11:50-11:57 | (C11)Progresses of TEM lamella preparation workflows in Carl Zeiss Japan | T. Kohata | Carl Zeiss Co., Ltd. |
| 11:57-12:04 | (C12)Electric properties inspection technology for wide bandgap materials by using contactless mobility measurement technique | M. Kumadaki, I. Kato, S. Salam | Semilab Japan K. K. |
| 12:04-12:11 | (C13)Electrical Defect measurement of SiC/GaN and other WideGap semiconductors | S. Salam, I. Kato, K. Masahiko | Semilab Japan K. K. |
| 12:11-12:18 | (C14)Construction of Evaluation Criteria in Fin-FET Structures for LSI Process Diagnosis | N. Otani, E. Yagyu, H. Tateyama, I. Murakami, Y. Yatagawa, K. Asai, K. Takamori | OKI Engineering Co., Ltd. |
Luncheon seminar
| 12:18-13:41 | (L1)Hitachi’s new nanoprobing system and FIB-SEM technology | B. Nanami, Y. Ii | Hitachi High-Tech |
Wednesday, Nov. 13, p.m. / Life Hall
Equipment and systems
Chairman：Kiyoshi Nikawa
| 13:41-14:06 | (10)X-ray nano-tomography enables high-resolution investigations from micro-bumps to hybrid bonding in advanced packaging | T. Dreier, D. Nilsson, S. Tanaka | Excillum AB |
| 14:06-14:31 | (11)Semiconductor application by novel nano X-ray CT device | T. Ogaki | Canon Marketing Japan Inc. |
《14:31～14:51 Authors corner & break》
Fault Localization
Chairman：Yasuo Cho
| 14:51-15:16 | (12)High-precision localization technique using AI | K. Oota(a, K. Sugiyama(b, M. Uchida(b | a)Toshiba Information Systems (Japan, b)Toshiba Corporation |
| 15:16-15:41 | (13)Evaluation of EBAC sensitivity improvement using lock-in amplifier | Y. Katakura | Sony Semiconductor Manufacturing Corporation |
《15:41～15:46 Group Photo》
《15:46～16:06 Authors corner & break》
Wednesday, Nov. 13, p.m. / Science Hall
Invited Talk III
Chairman：Koji Nakamae
| 16:06-17:06 | (I3)Development of SiC semiconductors at Mirise Technologies | H. Fujiwara | MIRISE Technologies |
《17:06～17:15 Authors corner & break》
《17:15～17:20 NANOTS2023 Awards》
《17:20～17:45 Committee Announcement》
Evening Session
Chairman：Koji Nakamae
| 18:00-20:00 | Introduction of P&A Workshop Activities, Etc. | T. Koyama | Fuji Electric Co., Ltd. |
Thursday, Nov. 14, a.m. / Science Hall
Invited Talk IV
Chairman：Hirotoshi Terada
| 09:30-10:30 | (I4)Crystal Defect Characterization Technology of Widegap Semiconductors using Multiphoton-Excitation Photoluminescence | T. Tanikawa | Osaka University |
《10:30～10:50 Authors corner & break》
Photonics technology
Chairman：Kazunobu Kojima
| 10:50-11:15 | (14)Evaluation of crystal quality by omnidirectional PL spectroscopy | K. Suzuki | Hamamatsu Photonics K.K. |
| 11:15-11:40 | (15)Evaluation of damage depth by ion-implantation process using plan-view cathodoluminescence | R. Sugie | Toray Research Center |
《11:40～12:00 Authors corner & break》
《12:00～13:15 Lunch Break》
Thursday, Nov. 14, p.m. / Science Hall
Invited Talk V
Chairman：Toru Koyama
| 13:15-14:15 | (I5)The Current Status and Future Prospects of Diamond Power Devices — The Story of the Founding of a Deep Tech Start-Up — | T. Fujishima | Power Diamond Systems, Inc. |
《14:15～14:35 Authors corner & break》
Power Device Analysis
Chairman：Masahiko Tsujita
| 14:35-15:00 | (16)Analysis of compound semiconductors using low accelerating voltage SEM and various CL detectors | T. Otsuka, Y. Nakajima, S. Asahina, T. Nagoshi, Y. Okano | JEOL Ltd. |
| 15:00-15:25 | (17)Quantitative evaluation of 3C-SiC/4H-SiC stacked structure MOS interface using scanning nonlinear dielectric microscopy | Y. Cho(a, H. Nagasaw(b, M. Sakuraba(a, S. Sato(a | a)Tohoku University, b)CUSIC inc. |
《15:25～15:45 Authors corner & break》
Physical Analysis
Chairman：Kiyoshi Nikawa
| 15:45-16:10 | (18)Case Study of Machine Learning Utilization in Semiconductor Analysis: Automation of Wire Bond Alloy Ratio Measurement | M. Sasaki | SCK |
| 16:10-16:35 | (19)Analysis of impurity doping in 3D GaN nanowire crystal | N. Sone(a, A. Nomura(a, R. Okuda(a, T. Takeuchi(b, M. Iwaya(b, S. Kamiyama(b | a)KOITO MANUFACTURING CO., LTD., b)Meijo university |
《16:35～16:55 Authors corner & break》
| 16:55-17:05 | (20)Closing remarks | K. Nakamae | Chairman, The Institute of NANO Testing |