| 1 | MARUBUN Corp. | Marubun Failure analysis solution | |
| 2 | FEI Company Japan Ltd. | Thermo Fisher Scientific | C6, C10 |
| 3 | Nippon Barnes Co., Ltd. | Projection Moire Warpage and Deformation measurement system “TDM” | |
| 4 | ITES Co.,Ltd. | Introduction of power semiconductor evaluation and analysis | |
| 5 | Hanwa Trading Corp. | Signatone, semiconductor inspection equipment | |
| 6 | MA-tek Japan Inc. | Contract analysis services | |
| 7 | Hamamatsu Photonics K.K. | Semiconductor failure analysis systems, Quantitative evaluation system for the quality of GaN single crystals | C3 |
| 8 | TOKI COMMERCIAL CO., LTD | Emission microscopes ＆ peripheral equipment | C4 |
| 9 | Tool Corp. | Advanced Failure Analysis Technique using LAVIS-plus | C2 |
| 10 | Toshiba NANOANALYSIS | Nano-Level Physical Analysis | |
| 11 | APOLLOWAVE Corp. | Imina Technologies Nano probing system | C5 |
| 12 | SEIKO FUTURE CREATION INC. | Advanced Techniques in Semiconductor Analysis: “FIB Circuit Repair” and “3D Cross-Sectional Analysis for Foreign Object Detection using FIB/TEM” | |
| 13 | Nippon Scientific Co. Ltd. | Valid Decapsulation systems | |
| 14 | Semilab Japan K.K. | For All Your Metrology Needs | C12, C13 |
| 15 | JEOL Ltd. | Failure analysis using electron microscope | C9 |
| 16 | Astron | Analysis System AZSA-HS | C8 |
| 17 | Sanyu Co.,Ltd. | Introduction of new product ELLMID – a local polishing machine for semiconductor devices | |
| 18 | Hightec Systems Corp. | JIACO MIP Decapsulation System & Neocera Magma MFI For Failure Analysis | |
| 19 | AD Science Inc. | Nano probing system for SEM/FIB, plasma cleaner, manipulators, sputter coaters | |
| 20 | IR System Co., Ltd. | Application of thermography for semiconductor failure analysis | |
| 21 | Excillum | Nanofocus X-ray source NanoTube / World’s brightest mifrofocus X-ray tube MetalJet | |
| 22 | Carl Zeiss Co., Ltd. | Introducing the new cutting-edge new X-ray microscope, Versa 730, and multimodal microscope systems | C11 |
| 23 | Nano Tech Solutions Inc. | MicroPREP PRO-FEMTO for high-speed sample processing system m | C1 |
| 24 | Qualtec Co., Ltd. | Development of non-destructive inspection method for solder voids and cracks using deep learning techniques | |
| 25 | TOYO Corp. | TENSOR, dedicated real-time 4D-STEM | |
| 26 | Hitachi High-Tech Corp. | Innovation, Synergy, Solutions -New EM Lineup | C7 |
| 27 | LTEC Co. | Product Benchmarking Services | |
| 28 | Oki Engineering Co., Ltd. | Construction of Evaluation Criteria in Fin-FET Structures for LSI Process Diagnosis | C14 |
| 29 | Comet Technologies Japan K.K. | Nano Testing Symposium | |
